Specifications

Technical Capabilities

Supported Capabilities

Type of assembly
  • THD (Thru-hole device) / Conventional
  • SMT (Surface-mount technology)
  • SMT  & THD mixed
  • Double-sided SMT and/or THD assembly
Order quantity
  • 1 to 1000
Components
  • Passives, smallest size 0603
  • Fine pitch to 0.5 mm
  • Connectors and terminals
Component packaging
  • Reels
  • Cut tape
  • Tube
  • Loose parts
  • QFN, DFN, LLP, BCC, LCC, CLCC, PSON, WSON, Modules
Board dimensions
  • Smallest size: 0.25” x 0.25”, 6mm x 6mm
  • Largest size: 15.75″ x 13.5″, 400mm x 340mm
Board shape
  • Rectangular
  • Round,
  • Slots,
  • Cutouts,
  • Complex,
  • Irregular
Solder Type
  • Leaded and Lead-Free
  • Water soluble solder paste
  • Manual and machine soldering
  • Special parts, e.g. wires and temperature sensitive parts.
Design file format
  • Gerber RS-274X, 274D, Eagle and AutoCAD’s DXF, DWG
  • BOM (Bill of Materials)
  • Pick and Place file (XYRS)